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BetaNews
Nov 27, 2015, 1:32 pm233 ptsSamsung has announced that it is starting mass production of the industry’s first "through silicon via" (TSV) 128GB DDR4 memory modules for high-end enterprise and data centre servers. This news follows on from its successful introduction of the 64GB 3D TSV DDR4 DRAM last year, which was an industry first.…
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