Winbond joins UCIe Consortium to support high-performance chiplet interface standardisation

Digitimes
Feb 15, 2023, 8:56 pm182 pts
Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium. The open industry standard defines interconnect between chiplets within a package, enabling an open chiplet ecosystem and facilitating the development of advanced 2.5D/3D devices.

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