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Mar 20, 2023, 4:10 am194 pts
Digitimes
BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip scale package (WLCSP) technology are showing signs of an oversupply, undermining backend demand and triggering…
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