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Sep 28, 2023, 4:23 am47 pts
Digitimes
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0 includes early 3D IC design capabilities that aim to significantly boost design efficiency, while the 3DFabric Alliance continues…
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