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Mar 13, 2024, 3:13 am191 pts
Digitimes
Refuting a Reuters report citing five people stating that Samsung Electronics will apply Mass Reflow Molded Underfill (MR-MUF) technology, which is the process used by SK Hynix, Samsung sent out an official statement that read, "Contrary to the news report, rumors about Samsung applying MR-MUF to its HBM…
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