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Jul 18, 2024, 6:35 am156 pts
Digitimes
C. C. Wei, chairman and CEO of TSMC, introduced the concept of "Foundry 2.0" and provided additional information regarding the company's advanced 2nm and A16 process technologies at its investor's conference on July 18. Wei also addressed the current shortage of CoWoS packaging, which is anticipated to be…
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