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Aug 26, 2024, 10:32 pm319 ptsTop
Digitimes
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has led to a shortage in Chip-on-Wafer-on-Substrate (CoWoS) technology, a critical component in advanced packaging. Manz AG, a major…
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