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PSMC unveils Logic-DRAM and 2.5D interposer
Digitimes
By Jingyue Hsiao
Sep 4, 2024, 11:23 pm
196 pts
Top
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
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