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Sep 24, 2024, 3:58 am215 ptsTrendingTop
Digitimes
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked system-on-integrated chips (SoIC) packaging is set to undergo a significant boost, according to a report by Taiwan's TechNews.
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