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Oct 7, 2024, 1:57 am180 ptsTrendingTop
Digitimes
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor. TSMC's front-end wafer fabrication plant in Arizona will closely collaborate with Amkor's back-end packaging and testing facility…
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