TCB packaging crucial in AI and HPC applications, says ASMPT

Digitimes
By Kevin WangOct 15, 2024, 9:51 pm190 ptsTrendingTop
Semiconductor and electronics manufacturing equipment supplier ASMPT sees sustained strong demand for thermocompression bonding (TCB) machines used in advanced packaging, as the trend for generative AI and high performance computing (HPC) continues. Additionally, the company is collaborating with IBM to…

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