TESCAN stakes its claim in advanced packaging with AI-fueled failure analysis breakthrough

Digitimes
By Levi LiMay 6, 2025, 3:51 am382 ptsTop
Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor packaging through its growing expertise in failure analysis (FA) technology. With Taiwan emerging as a global center for advanced packaging R&D, TESCAN plans to establish a local subsidiary…

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