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Aug 13, 2025, 7:48 pm234 pts
Digitimes
Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining its CoWoS packaging platform with a new silicon photonics engine dubbed "Coupe" to advance high-density computing and AI system…
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