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Sep 1, 2025, 6:32 pm116 pts
Digitimes
As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech aims to address the challenge with advanced fluxless bonding tools, targeting the market for HBM4 and beyond.
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