SEMICON Taiwan 2025: Hanmi Semiconductor unveils large 2.5D packaging equipment

Digitimes
By Jingyue HsiaoSep 11, 2025, 10:41 pm147 pts
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON Taiwan 2025, the South Korean company debuted its "2.5D big-die TC/FC bonder," designed for AI chips and capable of packaging…

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