Utechzone joins 3D IC alliance to expand semiconductor testing capabilities and depth

Digitimes
By Charlene ChenSep 12, 2025, 6:34 pm305 ptsTop
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September 9, 2025. Co-chaired by TSMC and ASE Holding, the alliance brings together over thirty major companies, including Unimicron, Delta…

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