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Sep 18, 2025, 9:48 pm203 pts
Digitimes
Huawei unveiled its next-generation Ascend AI chip roadmap at the 2025 Connect summit, highlighting a milestone for China's semiconductor ambitions. Starting in early 2026, the Ascend 950 PR will integrate Huawei's self-developed high-bandwidth memory (HBM), marking a pivotal advance in the country's drive for…
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