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Sep 22, 2025, 10:53 pm444 ptsHotTop
Digitimes
After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips. Industry sources say 12-inch SiC substrates are being explored for use in TSMC's CoWoS (chip-on-wafer-on-substrate) system,…
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