-
Dec 9, 2025, 10:53 pm157 pts
Digitimes
Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate (CoWoS) capacity. Order trends indicate GPU and ASIC customer demand will exceed expectations in 2026-27.
Trending Today on Tech News Tube
Tech News Tube is a real time news feed of the latest technology news headlines.
Follow all of the top tech sites in one place, on the web or your mobile device.
Follow all of the top tech sites in one place, on the web or your mobile device.
