-
Feb 3, 2026, 2:06 am118 ptsTrending
Digitimes
Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid ongoing memory shortages and rising demand for advanced packaging, Powertech aims to become the top partner outside the TSMC…
Trending Today on Tech News Tube
Tech News Tube is a real time news feed of the latest technology news headlines.
Follow all of the top tech sites in one place, on the web or your mobile device.
Follow all of the top tech sites in one place, on the web or your mobile device.


















