Hanmi Semiconductor strengthens ties with India amid Micron facility launch

Digitimes
By Jingyue HsiaoMar 4, 2026, 6:48 pm108 pts
South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry's first dual-function BOC COB Bonder, capable of performing both Board-on-Chip (BOC) and Chip-on-Board (COB) processes within a single system, according to Yonhap News Agency and Maeil Business…

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