Commentary: HBM hybrid bonding race heats up, but memory makers slow to adopt

Digitimes
By Levi LiMar 4, 2026, 10:53 pm121 ptsTrending
Competition in the high bandwidth memory (HBM) market is intensifying, prompting equipment makers such as Hanwha Semitech and Semes to accelerate development of hybrid bonding tools for HBM production. These newer entrants aim to challenge the thermal compression bonding (TCB) equipment segment dominated by…

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