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Aug 12, 2025, 12:08 pm108 pts
MacRumors
Apple's A20 chip in the iPhone 18 will be packaged with TSMC's Wafer-Level Multi-Chip Module (WMCM) technology, according to Apple supply chain analyst Ming-Chi Kuo. This change has been rumored by multiple other sources previously. Apple would be moving away from TSMC's InFO (Integrated Fan-Out) packaging it…
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