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Mar 28, 2017, 7:30 pm154 pts
PC World
Today’s processors, made using a single continuous slab of silicon, may soon give way to multiple chips interconnected at high speeds, Intel said Tuesday morning. Intel said its new Embedded Multi-die Interconnect Bridge, or EMIB, technology would let a 22nm chip connect to a 10nm chip and a 14nm chip, all on…
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