SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana — for HBM and other exotic memory types

Tom's Hardware
Mar 26, 2024, 4:49 pm105 pts
SK hynix plans to build a $4 billion chip packaging facility in Indiana, which could begin operations in 2029, according to a WSJ report. If the plant gets the green light, likely with tax incentives, it would focus on advanced packaging like that used for HBM3e and future HBM solutions.

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