Samsung accelerates R&D in MUF process and 2nd Gen MBCFET

Digitimes
By Judy LinMar 4, 2024, 1:48 am296 ptsTop
Samsung Electronics is reportedly promoting Molded Underfill (MUF) materials in its advanced packaging processes. Since SK Hynix has already adopted MUF technology for its High Bandwidth Memory (HBM) processes, Samsung's implementation of this technology has drawn the attention of related companies.

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