Hanmi won HBM equipment orders from Micron, Samsung next?

Digitimes
Apr 14, 2024, 10:42 pm140 pts
In recent years, due to the development of the High Bandwidth Memory (HBM) market, the thermal compression (TC) bonder equipment produced by Hanmi Semiconductor has attracted attention. Besides supplying SK Hynix, it has recently signed an HBM TC bonder supply contract with Micron and may receive additional…

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