SK Hynix announces deepening cooperation with TSMC to develop sixth-generation HBM

Digitimes
By Jack WuApr 19, 2024, 3:46 am94 pts
On April 19, SK Hynix announced that it had recently signed a memorandum of understanding (MOU) with TSMC. The two companies will collaborate closely on producing next-generation high bandwidth memory (HBM) products and enhancing advanced packaging technologies integrating HBM with logic layers.

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