Innolux takes significant strides in 3D chip packaging

Digitimes
By Jingyue HsiaoApr 29, 2024, 9:59 pm208 ptsTop
Innolux signed an agreement with Japan-based Tech Extension Co. (TEX) and Tech Extension Taiwan Co. (TEX-T) to introduce next-generation 3D packaging technologies based on Bumpless Build Cube (BBCube) to Innolux's cleanrooms as the display giant strides into the semiconductor industry.

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