Samsung reportedly speeds up 3D NAND, packaging, and substrate plans

Digitimes
By Charlene ChenMay 14, 2026, 12:53 am73 pts
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and high-bandwidth memory (HBM) competitiveness. The move signals…

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