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Aug 27, 2026, 12:29 am85 ptsTrending
Digitimes
Doosan Corporation's Electro-Materials BG has developed copper-clad laminate (CCL) technology that reduces the prepreg (PPG) insulating layer used in memory semiconductor package substrates from about 18µm to 13µm, and is preparing the material for mass production as thinner package designs raise the…
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