Samsung taps Japan for 3.xD chiplet push as packaging race heats up

Digitimes
Sep 17, 2026, 8:31 pm124 ptsTrending
Samsung Electronics is deepening its semiconductor ties with Japan as it develops large-area chiplet packaging technologies for high-performance computing and AI processors, tapping the country's materials, equipment and engineering ecosystem to strengthen its broader memory, foundry and advanced packaging…

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