Beyond 16 layers: HBM stacks test advanced packaging equipment makers

Digitimes
By Scarlett YuSep 28, 2026, 11:55 pm124 ptsTrending
At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding beyond the performance of individual tools to hybrid bonding, interface materials, defect metrology, process control,…

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