AI substrate material shortages ease, but advanced equipment emerges as expansion bottleneck

Digitimes
By Yunnie ChengOct 13, 2026, 3:30 am112 pts
As the customer base for AI accelerators expands rapidly and consumes IC substrate capacity, advanced packaging remains a critical industry bottleneck. Consequently, supply chain attention has shifted from upstream T-glass cloth used in copper-clad laminates (CCL) to the advanced manufacturing equipment…

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