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Oct 15, 2026, 11:53 pm186 ptsTrendingTop
Digitimes
As global wafer capacity expands rapidly, TSMC and GlobalFoundries (GF) are highlighting a fast-growing market for mature processes serving advanced applications. In particular, demand for silicon interposers, through-silicon vias (TSVs), and embedded deep trench capacitors (eDTCs) in advanced packaging is…
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