BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead

Digitimes
By Levi LiOct 15, 2026, 11:42 pm182 ptsTrendingTop
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an investor relations event on October 15, BOE said it had completed the full manufacturing process for glass-core substrates,…

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