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Aug 10, 2026, 3:25 pm124 ptsTrending
TechRadar
TSMC reportedly holding roughly $1 billion of finished A20 Pro wafers that cannot be packaged because the DRAM they must be integrated with has not yet arrived The bottleneck exists because Apple moved the A20 Pro to TSMC's WMCM packaging, which bonds processor and memory at the wafer level, removing the option…
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