Intel's EMIB packaging gains traction as chip designers look to skirt TSMC's CoWoS constraints — Google's reported decision for 9th-gen TPUs highlights Intel's attractive alternative

Tom's Hardware
Jul 15, 2026, 10:45 am129 pts
Google plans to use Intel's EMIB-T packaging for its next-generation TPU codenamed Humufish, according to SemiAnalysis. TSMC's portfolio of chip-on-wafer-on-substrate (CoWoS) technologies has become the de facto standard advanced packaging option for nearly all AI and HPC processors made in the industry.…

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