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Aug 24, 2026, 1:55 pm186 ptsTrendingTop
Tom's Hardware
SK hynix doesn't expect hybrid bonding to be ready for HBM4E, Jaesik Lee, VP of package engineering at SK hynix America, said during a presentation at Hot Chips 2026 on August 23, pushing the industry's most anticipated memory packaging transition out to HBM5 at the earliest. The problem, as he describes it, is…
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