The current state of Hybrid Bonding in 2026 — TSMC sits at 6 microns and the HBM delay that nobody expected

Tom's Hardware
Sep 2, 2026, 11:05 am81 ptsTrending
Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic chips and has just been postponed for use with memory. TSMC has scaled its SoIC bond pitch from 9 microns to 6 and laid out a path to 4.5 by 2029; Intel began shipping…

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