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Sep 29, 2026, 6:30 am187 ptsTrendingTop
Tom's Hardware
Intel has been granted a U.S. patent that discusses embedding MicroLEDs inside chip packaging, as TrendForce reports. The design embeds semiconductor dies fitted with MicroLEDs directly into a glass substrate and connects them using Through-Glass-Vias (TGV) to provide power and signal connections, allowing them…
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