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Oct 7, 2026, 9:00 am108 pts
Tom's Hardware
Qualcomm has reached a deal to license Huawei patents behind the LogicFolding chip-stacking method, Bloomberg reports. The technology, which is used in the Kirin 9050 Pro, splits nearly every block across two bonded dies, and a teardown and die shots show the lower die holds mostly cache and I/O. Qualcomm’s…
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