Apple launches iPhone 17 series with stable pricing amid tariff and market concerns
Sep 10, 2025, 12:30 am By Jingyue Hsiao
Apple unveiled the iPhone 17, 17 Pro, 17 Pro Max, and the slimmer iPhone Air on September 9, 2025.…Commentary: YMTC's decade-long march, leadership shifts, and the undercurrent of China's memory substitution drive
Sep 10, 2025, 12:20 am By Levi Li
YMTC, China's leading NAND flash producer, has unveiled a US$2.9 billion Phase III venture in Wuhan,…SEMICON Taiwan 2025: Zeiss hits High NA optics milestone as TSMC probes future of Hyper NA EUV
Sep 9, 2025, 11:58 pm By DIGITIMES
At SEMICON Taiwan 2025, Zeiss Semiconductor Manufacturing Technology offered a rare glimpse into the…Apple absorbs tariff impact, keeps most iPhone 17 prices steady to stay competitive
Sep 9, 2025, 11:48 pm By DIGITIMES
Apple has largely held steady on iPhone 17 pricing despite potential US tariffs on imported…Growth in military and semiconductor sectors fuels new momentum for IPC firms
Sep 9, 2025, 11:18 pm By Rodney Chan
Industrial PC (IPC) companies have begun releasing their revenue figures for August 2025. Despite…Apple leverages e-SIM support and competitive pricing to strengthen foothold in China
Sep 9, 2025, 11:16 pm By Jingyue Hsiao
Apple unveiled its latest iPhone 17 series on September 9, 2025, introducing four new models,…SEMICON Taiwan 2025: Memory giants compete in customized HBM race amid AI surge
Sep 9, 2025, 10:55 pm By Charlene Chen
The rising wave of artificial intelligence (AI) is driving the growing importance of high-bandwidth…Nvidia unveils Rubin CPX GPU for massive-context AI, available end 2026
Sep 9, 2025, 10:48 pm By DIGITIMES
Nvidia has introduced Rubin CPX, a next-generation GPU designed for massive-context AI, enabling…AI chip demand drives future semiconductor growth trends
Sep 9, 2025, 10:41 pm By Charlene Chen
SEMICON Taiwan 2025 opened on September 10, with numerous forums already underway ahead of the…OpenAI reportedly in talks to bring US$500 billion Stargate project to India, sparking data center expansion
Sep 9, 2025, 10:37 pm By DIGITIMES
The Economic Times, citing unnamed sources, reported that OpenAI is holding preliminary discussions…FOPLP progress is fastest in foundries, slower in testing and panel fabs
Sep 9, 2025, 10:08 pm By Charlene Chen
Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed…Compal partners with ZutaCore to redefine AI server cooling with waterless direct liquid technology
Sep 9, 2025, 9:51 pm By Willis Ke
Taiwan's Compal Electronics has announced a strategic collaboration with US-based ZutaCore, a leader…AI infrastructure investment may enter adjustment phase in 2026, with small-and medium-sized business demand driving new momentum
Sep 9, 2025, 9:24 pm By Jingyue Hsiao
At the SEMICON Taiwan event held in September, key international figures from the semiconductor,…AI guru warns superintelligence could endanger humanity; praises China's AI governance
Sep 9, 2025, 6:59 pm By Jingyue Hsiao
Geoffrey Hinton, a pioneering figure in AI, has expressed concerns that superintelligent AI might…Switzerland launches open-source AI model Apertus developed by top research institutes
Sep 9, 2025, 6:59 pm By Jingyue Hsiao
Switzerland has unveiled Apertus, an open-source large language model created through collaboration…Advanced packaging battle intensifies as foundry, OSAT, and PCB sectors enter tripartite era
Sep 9, 2025, 6:58 pm By Charlene Chen
Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process…Immigration crackdown exposes labor and capacity risks in US auto industry
Sep 9, 2025, 6:58 pm By Willis Ke
The US Department of Homeland Security (DHS) recently launched a large-scale raid at a Hyundai Motor…DDI supply chain shakeup for Apple's iPhone puts LX Semicon at risk
Sep 9, 2025, 5:07 am By Levi Li
China's BOE Technology is moving to diversify Apple's iPhone display driver IC (DDI) supply chain, a…Tesla to open new research and development center in Kopenick, Berlin
Sep 9, 2025, 4:52 am By Jingyue Hsiao
Tesla has announced plans to establish a new R&D center in Kopenick, Berlin, Germany. Positioned…TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
Sep 9, 2025, 4:40 am By Charlene Chen
To break through the technical, mass production, and yield challenges in advanced packaging…
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