How agentic AI and 'AI physics' are reshaping chip design
Sep 4, 2026, 4:20 am By DIGITIMES
As semiconductor designs advance toward trillion-transistor packages, the traditional engineering…South Korea taps chip windfall for next tech push
Sep 4, 2026, 3:16 am By DIGITIMES
South Korea is turning a semiconductor-driven tax windfall into a broader technology investment…Samsung turns to chips, OLED for next phase of Vietnam expansion
Sep 4, 2026, 3:03 am By DIGITIMES
Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end…MSScorps August revenue hits new high on silicon photonics gains
Sep 4, 2026, 2:31 am By Eifeh Strom
MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence…Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp
Sep 4, 2026, 2:11 am By DIGITIMES
Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion…SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology
Sep 4, 2026, 1:50 am By DIGITIMES
TAIPEI, Taiwan — The global semiconductor industry is hitting a physical wall. As artificial…G20 approves guidelines calling for more business-friendly AI regulation
Sep 4, 2026, 12:25 am By DIGITIMES
Delegates to the G20 summit have agreed to support proposed guidelines for a light touch on AI…Chunghwa Precision Test sees ASIC revenue overtaking GPU by 2027
Sep 4, 2026, 12:22 am By Lily Hess
Chunghwa Precision Test Technology said demand for AI and high-performance computing (HPC) is…Lite-On makes US$170 million strategic investment in DCX for AI cooling push
Sep 4, 2026, 12:20 am By Eifeh Strom
Lite-On Technology announced a strategic investment in Polish liquid cooling solutions provider DCX…India tablet market grows as business demand shifts toward premium devices
Sep 4, 2026, 12:15 am By DIGITIMES
India's tablet market posted modest growth in the second quarter of 2026, a sign that enterprise…K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap
Sep 4, 2026, 12:11 am By Levi Li
Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is…Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
Sep 3, 2026, 11:58 pm By DIGITIMES
Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of…CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
Sep 3, 2026, 11:56 pm By Lily Hess
To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving…Taiwan to expand AI compute capacity as supercomputer at research institute hits full load
Sep 3, 2026, 11:55 pm By Rodney Chan
Taiwan is racing to expand its AI compute capacity as demand for AI chips, GPUs and AI servers…Ennostar accelerates AI optical communications with micro LED
Sep 3, 2026, 11:52 pm By Charlene Chen
Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain…Processor, memory boom could push chip supply chain out of sync, says Yole
Sep 3, 2026, 10:56 pm By DIGITIMES
Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group,…Moonshot AI reportedly files for Hong Kong IPO, targets US$3B
Sep 3, 2026, 10:49 pm By DIGITIMES
Chinese AI startup Moonshot AI has reportedly filed confidentially for an initial public offering in…AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground
Sep 3, 2026, 10:46 pm By DIGITIMES
The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI…Silicon Valley overflow fuels semiconductor boom in California's Capital Region
Sep 3, 2026, 10:38 pm By DIGITIMES
A surge of multibillion-dollar industrial expansions is quietly transforming California's capital…Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab
Sep 3, 2026, 9:57 pm By DIGITIMES
The rapid expansion of artificial intelligence is forcing a radical shift from individual chip…
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