Chrome drops Chunghwa Telecom: A stress test for global certificate authority trust
Jun 4, 2025, 4:53 am By Levi Li
Google's decision to remove default trust for digital certificates issued by Chunghwa Telecom…Neousys posts 1Q25 revenue gain amid global uncertainties
Jun 4, 2025, 4:39 am By Vyra Wu
Taiwan's Neousys Technology reported first quarter 2025 consolidated revenue of NT$418 million…Syntec eyes IPO after doubling profits and expanding into robotics
Jun 4, 2025, 3:50 am By Elaine Chen
As the global robotics boom accelerates, Taiwanese firms are not only capitalizing on AI-driven…Top AI experts warn Trump's budget cuts threaten US tech leadership
Jun 4, 2025, 3:48 am By Jingyue Hsiao
Leading US artificial intelligence experts Fei-Fei Li and Andrew Ng have voiced strong concerns over…Global Lighting Technologies restructures production footprint amid supply chain shifts
Jun 4, 2025, 3:48 am By Jingyue Hsiao
Global Lighting Technologies is actively restructuring its global production strategy in response to…Exclusive: Chinese solar and battery US ambitions crumble under Trump's trade war
Jun 4, 2025, 3:46 am By Sherri Wang
US President Donald Trump has aggressively deployed tariffs and trade measures to prioritize…New era begins in South Korea: Lee Jae-Myung takes the helm
Jun 4, 2025, 2:36 am By DIGITIMES
South Korea had been navigating six months of political turbulence following former President Yoon…Samsung's DRAM yield jumps following bold redesign under new chief Jun Young-Hyun
Jun 4, 2025, 12:46 am By Levi Li
Samsung Electronics is accelerating its push to reclaim semiconductor leadership, spotlighting its…Samsung and SK Hynix lead AI-driven EDA revolution to power next-gen semiconductor design
Jun 4, 2025, 12:26 am By Sherri Wang
South Korea's semiconductor giants, Samsung Electronics and SK Hynix, are ramping up the adoption of…Greenet set for TPEx debut, eyes 430 million kWh resale in 2025 amid surging green power demand
Jun 4, 2025, 12:22 am By Willis Ke
Greenet, the power sales subsidiary of Green Energy Investment Group J&V Energy Technology, will…AI server boom drives Japan's Nittobo to hike fiberglass prices by 20%, Taiwan suppliers may follow
Jun 3, 2025, 11:54 pm By Vyra Wu
Japan's Nittobo raised prices for fiberglass cloth by as much as 20% starting in August, marking the…DDR4 Memory prices surge as chipmakers announce phase-out
Jun 3, 2025, 11:46 pm By Elaine Chen
Amid intensifying US-China tensions and persistent uncertainty in global demand, major memory…Kinpo Group sees steady growth, eyes AI and global expansion despite uncerntainty
Jun 3, 2025, 11:45 pm By Jingyue Hsiao
Despite persistent global political and economic uncertainties, Kinpo Group remains on a steady…SiC wafer market growth slows to 20% in 2025 amid fierce Chinese competition
Jun 3, 2025, 11:41 pm By Sherri Wang
The silicon carbide (SiC) power semiconductor market—once seen as a pillar of the EV…Kyushu leverages TSMC presence, launches five-year plan to build five advanced science parks
Jun 3, 2025, 10:56 pm By Sherri Wang
The Kyushu Regional Strategy Meeting, a coalition of economic leaders from Kyushu and surrounding…From displays to chips: BOE founder's new bet heads for Hong Kong Listing
Jun 3, 2025, 10:35 pm By Elaine Chen
Beijing ESWIN Technology Group, a relatively obscure chip design firm, has quietly made a major move…CoWoS material shortage triggers AI supply chain concerns; TSMC and ASE expected to receive priority access
Jun 3, 2025, 10:04 pm By Charlene Chen
As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence…South Korea maintains HBM chip lead while China faces tech and trade hurdles
Jun 3, 2025, 9:44 pm By DIGITIMES
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and…Six advisors behind Trump’s unpredictable tariff agenda
Jun 3, 2025, 6:55 pm By Willis Ke
As global trade tensions resurface, Wall Street insiders have coined a new acronym — TACO (Trump…ASE bets on new chip tech to handle AI’s rising power and speed needs
Jun 3, 2025, 6:53 pm By Jingyue Hsiao
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV)…
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