E Ink Holdings advances electronic shelf labels amid global smart retail growth
Jan 23, 2026, 4:00 am By Jingyue Hsiao
Taiwan-based E Ink Holdings is scaling up production of electronic shelf labels (ESLs) as global…Tesla's BEV moat erodes as Europe's legacy depth meets China's digital speed
Jan 23, 2026, 3:58 am By Charlene Chen
In 2025, Tesla's EV market share declined as Volkswagen's BEV sales surged in Europe, while Xiaomi…ASE Group's USI merges with EugenLight to expand silicon photonics module capacity in Vietnam
Jan 23, 2026, 3:56 am By Emily Kuo
ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching…Tata Group to invest US$11 billion in Maharashtra's Innovation City, boosting India's AI and semiconductor ambitions
Jan 23, 2026, 3:55 am By DIGITIMES
The Tata Group will invest INR1 trillion (US$11 billion) to build a state-of-the-art Innovation City…'Freedom isn't free': AIT director pledges US backing for Taiwan's asymmetric warfare strategy, defense supply chain
Jan 23, 2026, 2:59 am By Willis Ke
The American Institute in Taiwan (AIT) Director Raymond Greene, on January 22, reaffirmed strong US…Analysis: How Howard Lutnick is redrawing the memory-chip map
Jan 23, 2026, 2:57 am By DIGITIMES
US Commerce Secretary Howard Lutnick is driving a fundamental reordering of the global semiconductor…ASML leads chip equipment charge into advanced packaging
Jan 23, 2026, 2:57 am By DIGITIMES
Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They…TSMC and Samsung reduce 8-inch wafer capacity, but oversupply still remains
Jan 23, 2026, 2:56 am By Charlene Chen
TSMC chairman C.C. Wei confirmed adjustments in 8-inch and mature process capacities to improve…Palo Alto Networks urges fighting AI threats with AI in 2026
Jan 23, 2026, 2:50 am By Rodney Chan
James Yu, Palo Alto Networks' country manager in Taiwan, stated that while 2025 was predicted as the…South Korea-made EUV pellicles to be adopted at Samsung's Taylor fab
Jan 23, 2026, 1:31 am By Emily Kuo
Industry sources stated that Samsung has signed equipment contracts and placed orders for extreme…Google research finds that multi-agent debate within AI models improves reasoning beyond sheer computing power
Jan 23, 2026, 1:28 am By Jingyue Hsiao
Google's latest study reveals that enhancing artificial intelligence (AI) reasoning capabilities…RDIMM spot prices blow past US$2,000, raising odds of 80% Samsung memory hike
Jan 23, 2026, 1:16 am By Emily Kuo
Structural imbalances in the memory industry have emerged due to AI data center demand, sending…Taiwanese firms remain cautious as AI bubble debate persists
Jan 23, 2026, 1:11 am By Jingyue Hsiao
At Davos 2026, Microsoft CEO Satya Nadella cautioned that the rise of artificial intelligence (AI)…Intel’s “better than guidance” quarter comes with a catch
Jan 23, 2026, 12:23 am By DIGITIMES
Intel's latest financials highlight a fragile turnaround: while AI-linked data center demand and…Lip-Bu Tan faces Intel’s first real bottleneck of the AI era
Jan 23, 2026, 12:19 am By DIGITIMES
Intel outlined an increasingly AI-centric roadmap across client PCs, data centers, and…Intel slows its most ambitious node—and signals where the real battle is for now
Jan 23, 2026, 12:15 am By DIGITIMES
Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending,…Pan-International and Foxconn's EUR32 million investment signals shift toward robotics and advanced motor systems
Jan 22, 2026, 11:37 pm By Jingyue Hsiao
Pan-International Industrial has decisively moved into the humanoid robotics and high-performance…Ennostar partners with Allos to mass-produce 8-inch GaN-on-Si microLED wafers
Jan 22, 2026, 11:37 pm By DIGITIMES
Ennostar, Taiwan's largest LED manufacturer, said it has entered a strategic partnership with the…HBF likely overtaking HBM market by 2038 as commercialization speeds up
Jan 22, 2026, 11:36 pm By Sherri Wang
High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and…Fiberglass crunch spurs supply scramble as CCL makers ban order changes
Jan 22, 2026, 11:35 pm By Sherri Wang
As AI chip package sizes continue to grow, warpage issues in IC substrates have become more…
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