China smartphone market and industry, 2Q 2026
Jul 30, 2026, 9:48 pm By DIGITIMESChina smartphone market and industry, 2Q 2026: 2H26 shipments to drop by over 30% YoYApple targets AI subscription revenue as Cook exits and Ternus inherits next growth strategy
Jul 30, 2026, 9:31 pm By DIGITIMES
Apple is positioning AI as the foundation of its next growth phase, combining a privacy-focused AI…Apple braces for "hundred-year flood" in component costs
Jul 30, 2026, 9:15 pm By DIGITIMES
Apple's June quarter showed the strength of its core hardware business. Still, it also exposed a…Amazon's accelerating cloud growth reinforces AI investment case despite heavier spending outlook
Jul 30, 2026, 9:07 pm By DIGITIMES
Amazon reported stronger-than-expected second-quarter results as accelerating growth at its cloud…Apple beats quarterly estimates, but softer outlook and supply constraints temper optimism
Jul 30, 2026, 9:00 pm By DIGITIMES
Apple reported stronger-than-expected fiscal third-quarter results, driven by robust iPhone and Mac…Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy
Jul 30, 2026, 8:56 pm By DIGITIMES
The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026…German joint ventures in China fall below 50% utilization as imports weaken
Jul 30, 2026, 8:52 pm By DIGITIMES
German auto joint ventures in China slipped below 50% capacity utilization in 2025 as weaker…Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
Jul 30, 2026, 8:02 pm By Jingyue Hsiao
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening,…WAIC 2026 unveils AIDV shift as physical AI gains ground
Jul 30, 2026, 8:02 pm By Lily Hess
DIGITIMES Intelligence said its observations at the 2026 World Artificial Intelligence Conference…UMC raises capex to US$2B, eyes AI SiPh
Jul 30, 2026, 8:01 pm By Charlene Chen
UMC said on July 29 that it will raise 2026 capex from US$1.5 billion to US$2 billion, while…SPIL AI packaging investment boosts CTSP Erlin Park as first standard factory opens in 2H26
Jul 30, 2026, 8:01 pm By Willis Ke
The Central Taiwan Science Park's (CTSP) Erlin Park is set to reach a long-awaited milestone when…ASE sees full-year LEAP revenue topping US$3.5 billion amid tight packaging capacity
Jul 30, 2026, 5:41 am By Sherri Wang
ASE Technology Holding said growing demand for advanced packaging and testing, combined with…OpenAI's ChatGPT about to reach 1B weekly users as AI rivalry heats up
Jul 30, 2026, 5:41 am By DIGITIMES
OpenAI's chatbot is about to reach a new milestone of 1 billion weekly users, according to internal…Samsung signs five-year memory deals as chip shortage stretches to 2028
Jul 30, 2026, 4:54 am By DIGITIMES
Samsung Electronics has signed five-year memory supply agreements with five leading global data…South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand
Jul 30, 2026, 4:52 am By DIGITIMES
Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to…Microsoft's AI buildout: 88 new data centers, broader model catalog, silicon gains
Jul 30, 2026, 3:58 am By DIGITIMES
Microsoft CEO Satya Nadella laid out how the company is scaling its AI infrastructure and platform…China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing
Jul 30, 2026, 3:47 am By DIGITIMES
China's immersion DUV lithography programme has brought a little-known state-backed company into…Kumamoto quake exposes Kyushu auto supply-chain fault lines
Jul 30, 2026, 3:00 am By DIGITIMES
Japan's July 28 Kumamoto earthquake disrupted vehicle and component production across Kyushu,…South Korean suppliers win HBM4 tester orders from SK Hynix
Jul 30, 2026, 2:50 am By DIGITIMES
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4…GlobalFoundries lands US$300M CHIPS backing for AI silicon photonics
Jul 30, 2026, 2:48 am By DIGITIMES
GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential…
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