SK Hynix looks beyond HBM as inference workloads diversify
Sep 17, 2026, 5:27 am By DIGITIMES
SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference…Asia's healthcare AI moves from trials to real-world deployment
Sep 17, 2026, 5:18 am By DIGITIMES
At a healthcare AI forum in Wonju on Thursday, September 17, speakers from Taiwan and China argued…Deloitte Taiwan seminar highlights system integration as Physical AI moves into industrial applications
Sep 17, 2026, 4:55 am By Willis Ke
Taiwan's next opportunity in Physical AI may depend less on individual robot components than on its…Trumpf eyes glass as AI demand drives packaging innovation
Sep 17, 2026, 4:32 am By DIGITIMES
At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma…Samsung bets on zHBM as 2.5D memory nears its limits
Sep 17, 2026, 4:25 am By DIGITIMES
Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical…Topview sees supply-chain shifts supporting orders as AI investment reshapes its outlook
Sep 17, 2026, 4:20 am By Jingyue Hsiao
Topview Optronics said shifts tied to artificial intelligence are helping it secure orders through…Memory LTAs lock up 50-70% of capacity
Sep 17, 2026, 3:51 am By Charlene Chen
The memory industry remains in short supply, and major chipmakers are raising the share of capacity…The Trump-Jensen speakerphone diplomacy: how Nvidia turned political pressure into a seat at the table
Sep 17, 2026, 3:34 am By Yunnie Cheng
The relationship between Nvidia CEO Jensen Huang and US President Donald Trump has evolved from…VLEO emerges as next orbital frontier as China warns of critical 2026–2030 window
Sep 17, 2026, 3:13 am By Scarlett Yu
Very low Earth orbit (VLEO) is moving from concept toward real-world deployment.Humanoid robots could reshape MEMS demand as physical AI advances
Sep 17, 2026, 2:20 am By Jingyue Hsiao
Humanoid robots have not yet reached mass adoption, but their sensor needs are already reshaping…Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity
Sep 17, 2026, 2:15 am By Lily Hess
The global optical communications module market continues to grow, and Taiwan's test and packaging…Tier IV open-sources self-driving AI chip design to challenge Nvidia
Sep 17, 2026, 2:12 am By DIGITIMES
Japanese autonomous driving developer Tier IV is developing an AI chip and will release its chip…Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer
Sep 17, 2026, 1:49 am By DIGITIMES
Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure…Wiwynn sees strong AI demand offsetting US data center pushback
Sep 17, 2026, 1:14 am By Jingyue Hsiao
Wiwynn's top executive said demand for artificial intelligence infrastructure is likely to keep the…Samsung Galaxy S27 series rumored to feature 4 models, reshaping flagship lineup with display and camera upgrades
Sep 17, 2026, 1:00 am By Yunnie Cheng
Samsung Electronics is expected to launch its Galaxy S27 series in early 2027, marking what could be…China optical suppliers power smart glasses supply chain
Sep 17, 2026, 12:45 am By Lily Hess
China's optical suppliers are playing a growing role in the global smart glasses, VR, and AR supply…Samsung expands SRAM, IP to speed chip development
Sep 17, 2026, 12:30 am By Lily Hess
Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual…AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns
Sep 17, 2026, 12:29 am By DIGITIMES
Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the…Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects
Sep 17, 2026, 12:13 am By Levi Li
Foxconn Interconnect Technology (FIT), a subsidiary of Foxconn, held FIT Tech Day 2026 on September…Taiwan to pilot ETS by end-2026, experts urge three safeguards
Sep 17, 2026, 12:12 am By Charlene Chen
Taiwan will launch a pilot emissions trading scheme (ETS) by the end of 2026 to help semiconductor…
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