Power supply chain weighs price hikes, long-term contracts as copper price increases
Jan 2, 2026, 4:28 am By Emily Kuo
In the midst of the global energy transition, expanding AI infrastructure, and rising electricity…US approval of TSMC equipment exports to China reflects strategy shift
Jan 2, 2026, 4:24 am By Emily Kuo
Following reports that the US government had granted annual export licenses to South Korea's Samsung…China's CXMT moves toward IPO with global DRAM share nearing 4%
Jan 2, 2026, 4:20 am By Sherri Wang
China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public…Samsung rolls out 7,200Mbps DDR5 samples as SK Hynix, CXMT intensify competition
Jan 2, 2026, 3:28 am By Eifeh Strom
Samsung Electronics has reportedly begun sampling next-generation DDR5 memory, delivering speeds…Samsung aims for 2026 HBM4 mass production after customer validation
Jan 2, 2026, 3:17 am By DIGITIMES
Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory…Smartphones and notebook prices could increase as memory lead times extend
Jan 2, 2026, 3:14 am By Emily Kuo
Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory.…SanDisk, Micron vie for PSMC's Tongluo fab capacity
Jan 2, 2026, 3:09 am By Jingyue Hsiao
Market rumors and formal statements indicate two major memory companies, SanDisk and Micron, have…South Korea's quantum equipment makers anticipate major orders as data centers adopt QPU
Jan 2, 2026, 2:55 am By Emily Kuo
As quantum technology, one of South Korea's national strategic technologies, gradually shifts from…Budget delays risk sidelining Taiwan in 2026 silicon photonics and CPO takeoff, NSTC warns
Jan 2, 2026, 2:54 am By Willis Ke
Taiwan's National Science and Technology Council (NSTC) has raised concerns that prolonged delays in…China demand pushes Nvidia to seek more H200 capacity from TSMC
Jan 2, 2026, 2:49 am By DIGITIMES
Nvidia is in talks with TSMC to expand production of its H200 artificial intelligence chips as…Foxconn-backed Foxtron outlines 2026 growth plans amid 2025 revenue challenges
Jan 2, 2026, 2:39 am By Jingyue Hsiao
Foxtron, backed by Foxconn, held an investor briefing on December 31, 2025, to review recent…2026 electronics industry outlook
Jan 2, 2026, 1:23 am By Emily Kuo
As 2026 begins, DIGITIMES has conducted in-depth analyses of sectors within the electronics…Yageo adopts co-COO structure to support global expansion
Jan 2, 2026, 1:23 am By Eifeh Strom
Yageo, a leading Taiwanese passive components manufacturer, announced a major executive reshuffle,…Samsung, LG, SK, and Hyundai identify AI Transformation as core strategy for 2026
Jan 2, 2026, 1:20 am By Emily Kuo
South Korea's four major conglomerates, Samsung Group, LG Group, SK Group, and Hyundai Motor Group…China sees 2025 chip IPO surge as domestic AI and tech ambitions accelerate
Jan 2, 2026, 1:17 am By DIGITIMES
Chinese semiconductor companies are returning to the initial public offering (IPO, including…Server ODMs remain bullish through the end of 2026 despite bubble concerns
Jan 2, 2026, 12:08 am By Emily Kuo
Although AI bubble concerns persist, server ODMs remain optimistic about 2026. Nvidia's GB300 began…Samsung's Exynos chip faces challenges returning to Galaxy flagship, focuses on expanding applications
Jan 2, 2026, 12:07 am By Charlene Chen
Samsung Electronics' Exynos 2600 chip platform is confirmed to be used in the upcoming Galaxy S…ByteDance plans US$14B Nvidia H200 chip purchase in 2026
Jan 2, 2026, 12:07 am By Charlene Chen
ByteDance is reportedly preparing to invest about CNY100 billion (US$14.3 billion) in AI chips in…Samsung raises 2025 bonuses for DS division amid memory boom
Jan 2, 2026, 12:07 am By Charlene Chen
Samsung Electronics' Device Solutions (DS) division is set for a strong 2025, driven by robust…Spirox to ship self-developed TSV inspection equipment in 1H26, easing wafer fab bottlenecks
Jan 1, 2026, 7:46 am By Charlene Chen
Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging…
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