US-China trade tensions deepen as supply chains fracture despite tariff truce
Apr 3, 2026, 12:44 am By DIGITIMES
The trade environment for US businesses operating in or trading with China deteriorated sharply…US faces split Asia: allies build 'sovereignty walls' as digital tensions rise
Apr 3, 2026, 12:44 am By DIGITIMES
The 2026 National Trade Estimate (NTE) Report signals a new era of digital friction between the US…Samsung Electro-Mechanics lifts FC-BGA prices on AI-driven shortage
Apr 3, 2026, 12:44 am By DIGITIMES
Samsung Electro-Mechanics has raised prices for its high-end flip-chip ball grid array (FC-BGA)…2026 USTR Report: landmark 'ART' pact reshapes US-Taiwan trade landscape
Apr 3, 2026, 12:44 am By DIGITIMES
The Office of the United States Trade Representative (USTR) has designated Taiwan as a highly…Benefits of CXL in server memory configuration
Apr 2, 2026, 5:50 am By DIGITIMESGeneral-purpose server demand on the rise in 2026; continuous memory cost increases expected to…Wiwynn taps optics chief to deepen CPO push for AI servers
Apr 2, 2026, 4:16 am By Levi Li
Wiwynn has nominated LandMark Optoelectronics chairman and CEO Steven Chang to its 2026 board,…SpaceX files for IPO, setting stage for potential US$1.75 trillion valuation
Apr 2, 2026, 3:45 am By DIGITIMES
Elon Musk's private rocket company SpaceX, which has fundamentally reshaped modern spaceflight, has…IBM and Arm collaborate on dual‑architecture hardware to broaden enterprise AI deployment
Apr 2, 2026, 3:22 am By DIGITIMES
IBM and Arm announced a collaboration to build dual‑architecture hardware aimed at running AI and…Copper price surge drives quarterly lead frame price hikes
Apr 2, 2026, 3:20 am By Lily Hess
Lead frame packaging suppliers are hiking prices to pass along rising costs sweeping through the…South Korea reportedly advances GaAs localization with 95% yield on 4-inch process
Apr 2, 2026, 3:18 am By DIGITIMES
South Korea is moving closer to localizing high-performance compound semiconductor components long…Intel expands SambaNova stake, governance questions surface
Apr 2, 2026, 2:59 am By DIGITIMES
Intel plans to invest a further US$15 million in AI chip startup SambaNova Systems, lifting its…Asahi Kasei enters AI chip fiberglass market to challenge Nittobo's dominance
Apr 2, 2026, 2:00 am By Charlene Chen
Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass…Samsung ramps Texas fab as engineers gather for 2nm push
Apr 2, 2026, 1:52 am By DIGITIMES
Samsung Electronics has reportedly moved into the equipment installation and testing phase at its…France backs Taiwan's ProLogium with EUR1.5B subsidy to build solid-state battery factory
Apr 2, 2026, 12:39 am By Charlene Chen
The French government will provide about EUR1.5 billion (US$1.7 billion) in subsidies to support…Topco maintains stable shipments despite Middle East conflict, builds safety stock as AI demand accelerates
Apr 2, 2026, 12:34 am By Willis Ke
As the US-Iran conflict enters its second month, concerns are mounting over potential disruptions to…TCL acquires majority stake in Sony's home entertainment business in a strategic global JV
Apr 2, 2026, 12:19 am By DIGITIMES
Sony Corporation and TCL Electronics Holdings Ltd. have finalized agreements to form a strategic…Ajinomoto faces stakeholder pressure to raise ABF prices
Apr 2, 2026, 12:18 am By Emily Kuo
UK-based fund Palliser Capital announced on March 31 that it has become one of the top 25…Up Young targets double-digit revenue growth in 2026 through business and brand expansion
Apr 2, 2026, 12:16 am By Rodney Chan
Taiwan-based air conditioner and commercial laundry machine distributor Up Young Cornerstone plans…Nvidia invests US$2 billion in Marvell to integrate NVLink Fusion with ASICs
Apr 2, 2026, 12:02 am By Charlene Chen
On March 31, Nvidia announced a US$2 billion investment in Marvell and plans to further integrate…Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM
Apr 1, 2026, 11:55 pm By DIGITIMES
Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for…
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